Journal of Electrical & Electronic Systems

Department of Electrical and Electronic Engineering, University College Cork, Cork T12 R229, Ireland

Publications

• Mini Review   
  Photonic Integrated Heterogeneous 2 Dimensional / 3 Dimensional Microsystems
  Author(s): Guangbo Hao*
  
  The requirement for large-scale heterogeneous integration is being driven by the ongoing trend of exponential development in data communications and processing. We are seeing an increasing tendency in the development of 3D photonic integrated circuits (PICs), in addition to that of 2D PICs, which is similar to the pattern we have seen in the development of electronic integrated circuits. For creating 3D PICs, there are primarily two techniques. The first technique allows for freeform shaping of waveguides in any shapes and configurations thanks to ultrafast laser inscription (ULI). The second technique, multilayer stacking and coupling of planar PICs, makes use of relatively advanced 2D PIC fabrication procedures that are successively applied to each layer. There are benefits and drawbacks to both ways of fabricating 3D PICs, thus some applications might favour.. Read More»
  DOI: 10.37421/2332-0796.2022.11.39

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