Comprehensive Environmental Monitors with a Variety of Uses

Yuehe Lin^*
*Correspondence: Yuehe Lin, Department of Chemical Engineering, Pacific Northwest National Laboratory, USA, Email:

Introduction

A "Smart Dust" paradigm, where networks of mobile sensor nodes were envisioned to gather data about the physical environment, was only possible a decade ago thanks to advancements in sensor hardware and communication technologies. But in order to achieve "Smart Dust" networks, the size, power, and cost of the sensor nodes must be reduced. The key to lowering manufacturing costs is to simplify processes. At the same time, decreasing the footprint of numerous sensors makes it simpler to integrate them into platforms with limited space, such mobile phones, and to deploy nodes [1-3].

About the Study

As energy harvesting techniques advance, minimising power usage helps battery-powered nodes run for longer periods of time and gets them closer to being self-powered. Node costs falling will eventually allow sensor deployment in big networks and applications in consumer technologies. For applications ranging from habitat and environmental monitoring to parking lot occupancy, wireless sensor networks have been documented in the last ten years.

The usage of WSNs will be made possible by improvements in wireless communications, data storage, and analytics, which will alter how we interact with the outside world. For instance, Hewlett-concept Packard's for a Central Nervous System for the Earth integrates sensors, communications, cloud data storage, and analysis to exchange and manage rich environmental data that is both geographically and temporally distributed. Microelectromechanical systems are often employed in WSNs, and improvements in their production, materials, and design are bringing down the size, power, and cost of each individual sensor [2].

Integration of several sensing tasks onto a single MEMS device presents a chance for further cost savings. While the sensor community has not yet broadly adopted this idea, the integrated circuit industry has profited from integration to lower the size, cost, and power of ICs while boosting their functionality. Commercially available discrete sensor parts can measure factors like light intensity, humidity, or temperature, but there aren't many coupled sensors that can offer multiparameter data. However, researchers have illustrated multimodal sensing in the context of chemical sensing, when redundant measurements are advantageous. In a single chip for multiparameter gas chemical analysis, Hagleitner et al. incorporated mass-sensitive, capacitive, calorimetric, and temperature transducers.’

Two competing objectives—to integrate the sensor functions necessary for a universally useful environmental sensor that offers the added benefits of cross-sensitivity compensation and to reduce the complexity of the fabrication process—guided the design of the M-FISes sensors and fabrication process. Technique to show the possibility of inexpensive mass manufacturing. To give the capabilities of a "weather centre" with motion or activity detection, ten sensor functions were targeted. Ten sensor functionalities must be combined into a single manufacturing. We concentrated on robust transduction mechanisms throughout the process. Conflicting design and manufacturing parameters were balanced [4,5].

Conclusion

We discovered a combination of four transduction mechanisms-resistive, piezoresistive, capacitive, and p-n junction—that could produce the needed sensor functionalities and performance. Then, in order to apply these transduction mechanisms while reducing the amount of mask stages in the procedure, we created a mixed surface and bulk micromachining technique employing silicon-on-insulator wafers.

References

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4. Sylvain, Matthieu, Francis Lehoux, Steeve Morency, and Félix Faucher, et al. "The EcoChip: A wireless multi-sensor platform for comprehensive environmental monitoring." IEEE Trans Biomed Circuits Syst 12(2018): 1289-1300.

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