Senior Lecturer & Director- Bioengineering program, Department of Applied Sciences
University of Otago, Dunedin, New Zealand
Dr Azam Ali holds (BSc (hons.) & MSc) in Chemistry (Dhaka, Bangladesh) and PhD degree in Polymer & Materials Science and Engineering (USM) in the year 2000. He worked as a postdoctoral/research fellow in a numerous institutes e.g. POSTECH (South Korea) and University of North Carolina, Charlotte, UNCC (USA). Prior to his present position, he worked over 10 years in New Zealand Govt. research organisation (AgResearch) as a senior scientist, and leads biomaterials and medical devices research team at Lincoln, Christchurch, New Zealand. He is recognised as an international biomaterial scientist, have been working over 21 years in biomaterials areas, who has published more than 42 peer-reviewed articles and one book chapter. At present he holds 18 international patents and patent specifications. Dr. Azam is working as a senior lecturer and Director, Bioengineering program, and leads Biomaterials, Bioengineering and Regenerative Medicine research team in the Department of Applied Sciences, the University of Otago (Dunedin). He specialises in biomaterials (including biologic tissues), Bioengineering design, developing medical devices/technologies and nanoscience & nanotechnology. The innovative technology pioneered by Dr Azam uses low value protein sources from the New Zealand wool industry to create novel medical devices (e.g. wound care, bone implants, soft tissues, and bioabsorbable suture). Three of his chronic/diabetics wound care medical products have been commercialised and are manufactured in New Zealand for use as dressings (matrix), hydrogel, foam, particularly for chronic wounds management. They have already granted all regulatory (ISO 13485, FDA, TUV, TGA) approval and currently commercialised over 17 countries including in the USA, EU, AU & NZ. He was awarded the Bayer Year of the Innovators Awards 2010 (namely New Zealand Innovator Awards) or his significant science contribution to the Health and Science sectors.
Materials and Biomaterials (including biologic materials) Sciences, Engineering & Technology, Additive manufacturing (3D printing) & Electro(nano)spinning technology, Bioengineering and Medical devices/technology, Nanosciences and Technology: Functional and nanostructure biomaterials, Formulations (bioactives, drugs, etc.), microencapsulation and control released technology
Professor, Director of Aerospace Engineering
Washington University, USA
Professor Ramesh K. Agarwal is the William Palm Professor of Engineering and the director of Aerospace Engineering Program and Aerospace Research and Education Center at Washington University in St. Louis from 1994 to 200. He was the Sam Bloomfield Distinguished Professor and Executive Director of the National Institute for Aviation Research at Wichita State University. Dr. Agarwal received Ph.D in Aeronautical Sciences from Stanford University in 1975, M.S. in Aeronautical Engineering from the University of Minnesota in 1969 and B.S. in Mechanical Engineering from Indian Institute of Technology, Kharagpur, India in 1968. Professor Agarwal has worked in Computational Fluid Dynamics (CFD), renewable energy systems and nanotechnology. He is the author and coauthor of over 300 publications and serves on the editorial board of fifteen journals. Dr. Agarwal is a Fellow of fifteen societies including American Association for Advancement of Science (AAAS), American Institute of Aeronautics and Astronautics (AIAA), American Physical Society (APS), American Society of Mechanical Engineers, Society of Manufacturing Engineers (SME), Institute of Electrical and Electronics Engineers (IEEE), American Academy of Mechanics (AAM), and Institute of Physics. Astronautics (AIAA), American Physical Society (APS), American Society of Mechanical Engineers, Society of Manufacturing Engineers (SME), Institute of Electrical and Electronics Engineers (IEEE), American Academy of Mechanics (AAM), and Institute of Physics.
Nanomaterials,Carbon Nanostructures, Nanoparticles, Numerical Modeling and Simulation.