Short Communication - (2025) Volume 13, Issue 1
Received: 01-Feb-2025, Manuscript No. jaat-25-168458;
Editor assigned: 03-Feb-2025, Pre QC No. P-168458;
Reviewed: 17-Feb-2025, QC No. Q-168458;
Revised: 22-Feb-2025, Manuscript No. R-168458;
Published:
28-Feb-2025
, DOI: 10.37421/2329-6542.2025.13.340
Citation: Van, Nguyen. “Thermal Management Techniques in High-power Aerospace Electronic Systems.” J Astrophys Aerospace Technol 13 (2025): 340.
Copyright: © 2025 Van N. This is an open-access article distributed under the terms of the Creative Commons Attribution License, which permits unrestricted use, distribution, and reproduction in any medium, provided the original author and source are credited.
The unique challenges of thermal regulation in aerospace applications stem from the combination of high power densities, limited available space, and the harsh environmental conditions encountered at high altitudes or in space. In vacuum conditions, for instance, convection is absent, and radiation becomes the primary mode of heat dissipation. On aircraft and spacecraft, components may be subject to wide thermal gradients, intermittent heat loads, and restricted airflow. As such, thermal management strategies must be both lightweight and efficient, integrating seamlessly with structural and operational constraints. Engineers must also ensure that thermal systems function reliably under vibration, acceleration, and radiation, which are all common in aerospace missions.
Passive thermal control systems are widely employed in aerospace electronics due to their simplicity and reliability. These include heat sinks, thermal straps, Phase Change Materials (PCMs), and Thermal Interface Materials (TIMs). Heat sinks are used to increase the surface area available for heat dissipation, while thermal straps, often made of flexible conductive materials such as pyrolytic graphite or copper braid, transfer heat from hot components to cooler areas. PCMs absorb excess heat by undergoing a phase transition (usually solid-to-liquid), thereby stabilizing component temperatures during peak load. TIMs, applied between electronic components and heat spreaders, improve thermal contact and reduce interface resistance, allowing for more efficient heat transfer.
Active thermal control techniques provide greater flexibility and adaptability, particularly for systems with variable power consumption or dynamic thermal environments. Liquid cooling systems, including pumped liquid loops and two-phase heat transport systems, are increasingly utilized in high-power aerospace electronics. These systems use a coolant to absorb and transport heat to a remote radiator or heat exchanger. Two-phase systems, such as Loop Heat Pipes (LHPs) and Capillary Pumped Loops (CPLs), exploit the latent heat of vaporization to move large quantities of heat with minimal temperature gradient. These are especially valuable in spacecraft, where gravitational forces are absent, and passive capillary action must drive fluid movement [2].
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