Upcoming Special Issue
Purpose: To publish the most exciting research with respect to the subjects of Journal of Bioengineering and Biomedical Science and to provide a rapid turn-around time regarding reviewing and publishing, and to disseminate the articles freely for research, teaching and reference purposes.
Special Issue Topics
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Peng Li
Rheonix, USA
Tel. 607-257-1242 x183
Fax: 607-257-0979
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Nikos Chronis
Department of Biomedical Engineering
University of Michigan, USA
Tel.310-267-4985
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Eduardo de Faria Franca
Laboratory of Crystallography and Computational Chemistry
Institute of Chemistry
Federal University of Uberlandia
Uberlandia, Brazil
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Faris Q. Alenzi
Associate professor
Prince Salman University
Saudi Arabia
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Gopinath Mani
Biomedical Engineering
The University of South Dakota, USA
Tel. 605-367-7773
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Kadhiravan Shanmuganathan
Department of Chemical Engineering
University of Texas at Austin
USA
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Serge Grabtchak
Adjunct Professor
Electrical Engineering Department
Dalhousie University
Department of Physics
University of Prince Edward Island
University Avenue, Canada
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David Caudell
Department of Biomedical Sciences and Pathobiology
College of Veterinary Medicine, Virginia Tech, USA
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Kytai Truong Nguyen
Associate Professor
Department of Bioengineering
University of Texas at Arlington, USA
Tel. 817-272-2540
Fax: 817-272-2251
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Partha Roy
Associate Professor
Departments of Bioengineering and Pathology
University of Pittsburgh, USA
Tel. 412-624-7867
Fax: 412-383-8788
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Lisa M. Larkin
Associate Professor
Molecular & Integrative Physiology
Biomedical Engineering
University of Michigan, USA
Tel. 734-936-8181
Submission Process
Submit Special Issue articles online through manuscript submission, review and editorial tracking system for quality and quick review processing at https://www.hilarispublisher.com/bioengineering-biomedical-science/submit-manuscript.html
Note:
- In case of online submission, please select "Special Issue Article" from the dropdown list.
- In case of e-mail, please specify the title of the special issue in the subject and in the cover letter of the submission.
