Journal of Textile Science & Engineering

The Influence that the Blend Process has on the Hardening Behavior of a PU/Epoxy Resin System

Abstract

Hsien-Tang Chiu

To address the future needs of anisotropic conductive film (ACF) applications, a system that enables rapid hardening and prolongs the shelf life of ACFs was developed. In this study, various processing methods and conditions were employed to fabricate microcapsules. Imidazole was used as a hardener for epoxy resin, which was then identified and analyzed using Fourier transform infrared spectroscopy. The latent hardening behavior of microcapsules was examined using differential scanning calorimetry. Thermomechanical analysis and a peeling test were employed to analyze the thermal properties and adhesion. When coated with microcapsules, the hardener reacts to epoxy resin for a longer time. Latent hardeners with differing reaction rates can be prepared by selecting varying shell materials.