Pure copper, with its excellent electrical and thermal conductivity, is an essential material in a variety of industrial applications, including electronics, power transmission, and heat exchangers. However, welding pure copper presents unique challenges due to its high thermal conductivity, low melting point, and susceptibility to distortion during welding. This is particularly true when working with thin copper foils, which are commonly used in highprecision applications such as microelectronics, flexible circuits, and battery technology. To address these challenges, blue diode laser welding has emerged as an effective method for joining pure copper foils. This welding technique, which uses a high-intensity blue laser, offers precise control over the welding process, reducing heat-affected zones and minimizing material distortion. To optimize the welding of copper foils and improve mechanical properties, it is essential to consider not only the thermal dynamics of the process but also the underlying fluid mechanics that govern the molten pool behavior, material flow, and solidification
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Fluid Mechanics: Open Access received 291 citations as per Google Scholar report
